For Immediate Release

Vicor Corporation’s ‘ChiP’ Power Component Packaging Technology Honored with American Technology Award

TechAmerica Foundation award recognizes breakthrough innovation in the Semiconductors and Electronic Components sector


Andover, MA – June 24, 2013 – Vicor Corporation (NASDAQ:VICR) today announced that it has been honored with the 2013 TechAmerica Foundation American Technology Award in the semiconductors and electronic components category. The American Technology Awards, selected on the basis of a thorough evaluation by industry experts and technology leaders, span the technology industry recognizing products and services that demonstrate breakthrough innovation and market disruption potential.

Vicor was honored with this award for its new Converter housed in Package (ChiP) power component packaging technology. ChiP packaging technology leverages Vicor’s world-class power expertise and manufacturing capabilities with a new generation of ultra-high density, thermally-adept power components. Components based on Vicor’s scalable ChiP packaging technology have already demonstrated a 2X increase in power density versus earlier generation components, enabling customers to achieve previously unattainable system size, weight and efficiency targets.

“Vicor’s new ChiP technology embodies our vision of a power component methodology that enables designers to architect complete systems – from the AC wall plug to the point of load – utilizing high-performance ‘building blocks’,” said Patrizio Vinciarelli, CEO, Vicor Corporation. “Vicor’s significant investment in ChiP power components affords customers sustained technical and commercial advantages that differentiate them from their competitors.”

“Congratulations to Vicor on their outstanding technology achievement, distinguished among many brilliant innovations in this very competitive award category,” said Shawn Osborne, TechAmerica Foundation Chairman. “We are thrilled to honor their innovation with an American Technology Award.”

The award winners were announced last Thursday at the Technology and Government gala dinner, a premier Washington, D.C. technology networking event bringing together hundreds of industry and government leaders to celebrate the technology industry.

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About Vicor Corporation
Headquartered in Andover, Massachusetts, Vicor Corporation designs, manufactures and markets innovative, high-performance modular power components, from bricks to semiconductor-centric solutions, to enable customers to efficiently convert and manage power from the wall plug to the point of load. Complementing an extensive portfolio of patented innovations in power conversion and power distribution with significant application development expertise, Vicor offers comprehensive product lines addressing a broad range of power conversion and management requirements across all power distribution architectures, including CPA, DPA, IBA, FPA™ and CBA. Vicor focuses on solutions for performance-critical applications in the following markets: enterprise and high performance computing, telecommunications and network infrastructure, industrial equipment and automation, vehicles and transportation and aerospace and defense electronics.


Vicor and FPA are trademarks of Vicor Corporation.

Colin Boroski
Rainier Communications
508-475-0025 x 142