Product Matrix
Input Voltage(V): 
Output Voltage (V): 
Power [W]: 
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Family
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Features Industry Standard Eighth and Quarter Bricks
High Efficiency: >98%
High Density: 255 W/in²
High Efficiency and High Power Density High Efficiency and Thermally Enhanced High Efficiency and High Power Density Very High
Power Density
High Efficiency and Thermally Enhanced High Power Broad Vout Trim Range
Broad Selection
and
Current Source Module
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Data Sheets


Input Voltage 38 – 55 Vdc
36 – 60 Vdc
18 – 75 Vdc
Four Input Ranges
18 – 75 Vdc
Four Input Ranges
38 – 55 Vdc / 330 – 400 Vdc Four Input Ranges 36 - 75
18 - 36
41 - 57
Vdc
38 – 55 Vdc / 330 – 400 Vdc Four Input Ranges 9 – 425 Vdc
Eight Input Ranges
10 – 400 Vdc Twelve Input Ranges
Output Voltage(s) 4:1 and 5:1 fixed ratio
12 and 9.6 V at 48 Vin
1.19 – 55 Vdc 0.82 – 55 Vdc 1.2 – 55 Vdc 3.3 Vdc
12 Vdc
18 Vdc
1 – 48 V 2 – 54 Vdc 2 – 95 Vdc
Power 300 – 850 W 120 – 500 W 120 – 320 W 120 – 325 W 10 – 60 W 135 – 325 W 50 – 600 W 25 – 200 W
Package Eighth Brick,
Open Frame
2.30" x 0.9" x 0.38"
(58,4 x 22,9 x 9,53 mm)

Quarter Brick,
Open Frame
2.30" x 1.45" x 0.41"
(58,4 x 36,8 x 10,5 mm)
Full Chip
1.28" x 0.87" x 0.265" (32,5 x 22,0 x 6,73 mm)

Half Chip
0.87" x 0.65" x 0.265" (22,0 x 16,5 x 6,73 mm)
Full Size Flanged 1.91" x 1.09" x 0.37"
(48,6 x 27,7 x 9,5 mm)
Full Chip
1.28" x 0.87" x 0.265" (32,5 x 22,0 x 6,73 mm)

Half Chip
0.87" x 0.65" x 0.265" (22,0 x 16,5 x 6,73 mm)
Power System in Package (PSIP)
0.87" x 0.65" x 0.26" (22,0 x 16,5 x 6,73 mm)
Full Size Flanged 1.91" x 1.09" x 0.37"
(48,6 x 27,7 x 9,5 mm)
Maxi
(Full Brick)
4.6" x 2.2" x 0.5’’ (117 x 55,9 mm)
Mini
(1/2 Brick)
2.28" x 2.2" x 0.5’’ (57,9 x 55,9 mm)
Micro
(1/4 Brick)
2.28" x 1.45" x 0.5’’ (57,9 x 36,8 mm)
VI-200 (Full Brick): 4.6" x 2.4" x 0.5" (116,9 x 61,0 x 12,7 mm)
VI-J00 (Half Brick): 2.28" x 2.4" x 0.5" (57,9 x 61,0 x 12,7 mm)
Mounting Through Hole SMT or Through Hole

Half Chip only SMT
Through Hole SMT or Through Hole
Half Chip only SMT
SMT Through Hole Through Hole Through Hole
Family
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Features High Efficiency
Thermally Enhanced
MIL-STD- 810 Qualified
High Power
High Vout Trim Range
MIL-STD-810 Qualification
Environmental Stress Screening
Broad Selection
MIL_STD-810 Qualification
Environmental Stress Screening
High Efficiency
MIL-STD-810 Qualification
High Efficiency
MIL-STD-810 Qualification
MIL-STD-704 E/F Compliant
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Data Sheets






Input Voltage VTM & PRM
16 – 50 Vdc
BCM - 240 – 330
9 – 425 W
Eight Input Ranges
28 and 270 Vdc Inputs per MIL-STD-704D/E/F
155 Vdc Input per MIL-STD-1399A
16 – 50 Vdc Input Range 240 – 330 Vdc
Output Voltage(s) VTM & PRM
0.81 – 50 Vdc
BCM - 30.0 – 41.25 Vdc
2 – 54 Vdc 2 – 48 Vdc 0.81 – 30 Vdc 30.0 – 41.25 Vdc
Power PRM & VTM
120 Watts
BCM - 235 Watts
50 – 600 W 10 – 100 W 414 W/in3 235 W
Package Full Size Flanged 1.91" x 1.09" x 0.37"
(48,6 x 27,7 x 9,5 mm)
Maxi
(Full Brick)
4.6" x 2.2" x 0.5’’ (117 x 55,9 mm)
Mini
(1/2 Brick)
2.28" x 2.2" x 0.5’’ (57,9 x 55,9 mm)
Micro
(1/4 Brick)
2.28" x 1.45" x 0.5’’ (57,9 x 36,8 mm)
MI-200 (Full Brick): 4.6" x 2.4" x 0.5"
(116,9 x 61,0 x12,7 mm)
MI-J00 (Half Brick): 2.28" x 2.4" x 0.5"
(57,9 x 61,0 x 12,7 mm)
Full Chip
1.28" x 0.87" x 0.265" (32,5 x 22,0 x 6,73 mm)
Full Chip
1.28" x 0.87" x 0.265" (32,5 x 22,0 x 6,73 mm)
Mounting Through Hole Through Hole Through Hole SMT or Through Hole SMT or Through Hole