Innovations in Power

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High Voltage
DC Distribution

 
Mainstream Industry Adoption
 
From datacenters and alternative energy micro-grids, to aircraft and hybrid vehicles, high voltage DC power distribution and conversion enables major advances in application performance while reducing installation and running costs.

 

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Innovations
in Computing

 
New Performance Standards in Datacenter and Cloud Computing Infrastructures
 
Enabling space and power chain efficiencies in an innovative approach departing from the  conventional multiphase power conversion approach
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ChiP Packaging Technology

 
Vicor Converter housed in Package (ChiP) Technology
 
Scalable power component packaging technology breaks new barriers for performance and design flexibility, and delivers breakthrough 4X increase in power density
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VIA Packaging
Technology

 
Vicor Integrated Adapter (VIA) Packaging Technology
 
Mechanically and Thermally adept, VIA Package Technology extends Vicor’s Power Component Methodology with industry-leading Front End Solutions

Explore the continued evolution of tightly integrated, ultra-high density, thermally-optimized power components enables designers to attain new levels of design versatility and transcend the thermal limitations imposed by conventional power solutions. Maximize design success and minimize time to revenue, yielding differentiated, high-performance systems with ‘building block’ ease and flexibility.

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