Introducing Vicor’s Converter housed in Package (ChiP) Technology

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Scalable power component packaging technology breaks new barriers for performance and design flexibility, and delivers breakthrough 4X increase in power density

 

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Newly Released Products
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VI Chip® VTM® Current Multiplier >   NBM™ Non-isolated Bus Converter Module >
 
VI Chip® 48 to 12 V BCM® Bus Converter >   BCM® Low Voltage Bus Converter Module >
 
VI Chip® BCM® Bus Converter >   DCM™ DC-DC Converter Module >
 
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Download
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Technical Documents
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White Paper      
Thermal Management Design Resources for Vicor ChiP Products PDF   Download >
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White Paper      
Introducing Vicor’s Converter housed in Package (ChiP) Technology PDF   Download >
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Videos
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Video: Vicor at electronica 2014   VIDEO
The Benefits of Designing with Power Components
Claudio Tuozzolo
President of Vicor’s Picor Division
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Video: Non-invasive Power for Dense Industrial Applications   VIDEO
Non-invasive Power
for Dense Industrial Applications
Demo of component power design methodology, from AC and HVDC power sources direct to point of load
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Marco Panizza
Manager, Applications Engineering
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Video: 2013 APEC Plenary Session with Patrizio Vinciarelli   VIDEO
2013 APEC Plenary Session
Patrizio Vinciarelli
CEO, Vicor Corporation
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Video: Introduction to Vicor ChiP Technology   VIDEO
An Introduction to ChiP Technology
Stephen Oliver
Vice President, VI Chip Product Line
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Video: APEC 2013   VIDEO
APEC 2013
Gary Gill
Director, VI Chip Product Line
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ChiP Technology
Elektra 2014 Award
American Technology Award 2013  
EDN Hot 100 Products of 2013
             
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Press Coverage
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Vicor (Press Release)
Vicor Corporation Launches New ChiP-based DCM™ Converter Modules   Read >
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Vicor (Press Release)
Vicor Pushes Power Density Boundaries and Introduces Digital Communication Capability with New ChiP Bus Converter Modules   Read >
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Electronic Design (Article)
400-V DC Distribution
in the Data Center Gets Real
  Read >
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EDN (Article)
Vicor Corporation ChiP bus converter modules   Read >
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Vicor (Press Release)
Vicor Corporation Delivers
First ChiP Power Modules
  Read >
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Power Systems Design (Cover Article)
Addressing 400-Vdc power in advanced industrial and data-center apps   Read >
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Vicor (Press Release)
Vicor’s ChiP Power Component Packaging Technology Named One of the Hot 100 Products of 2013 by UBM Tech’s EDN   Read >
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EDN (Article)
EDN Hot 100 products of 2013:
Components and sensors
  Read >
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Electronic Design (Article)
Next-Generation Servers
Require Robust Power Platforms
  Read >
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Power Electronics (Article)
New Thermal-design Options
Drive Power Density
  Read >
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Vicor (Press Release)
Vicor Corporation’s 'ChiP' Power Component Packaging Technology Honored
with American Technology Award
  Read >
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Engineering TV (Video)
Video interview presenting ChiP packaging technology   Watch >
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Power Systems Design (Video)
Demo of Complete AC to Point of Load Solution at PCIM   Watch >
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EDN (Article)
Vicor reveals new ChiP power package
at APEC 2013
  Read >
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