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Attributes of high‑performance power module packaging

Attributes of high‑performance power module packaging image

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From the first Brick to today’s ChiP™ (Converter housed in Package), Vicor has been continually innovating to deliver higher‑performance solutions to power‑system engineers. These innovations are a result of a steadfast focus on advancing four essential technology pillars: power delivery architectures, control systems, topologies and packaging.

The fourth pillar, power module packaging, has been a unique differentiator for Vicor since its inception. There are several attributes that enable a high‑performance power module package, and Vicor consistently leads the industry in advancing each one:ƒ high power and current density, thermal adeptness, integrated magnetics, compatibility with high‑volume PCB assembly techniques along with automated and scalable high‑volume manufacturing.