Introducing Vicor’s Converter housed in Package (ChiP) Technology

Scalable power component packaging technology breaks new barriers for performance
and design flexibility, and delivers breakthrough 4X increase in power density

 
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  Newly Released Products
 
  VI Chip DCM™ DC-DC Converters  
 
VI Chip® DCM™ DC-DC Converter >
Read about our newly released
VI Chip DCM module in ChiP Packaging
 
  VI Chip® 400 V BCM® Module in ChiP Packaging  
 
VI Chip® 400 V BCM® Module >
Read about our newly released
VI Chip BCM module in ChiP Packaging
 
 
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  Download
  Technical Documents
 
  White Paper
  Thermal Management Design Resources for Vicor ChiP Products
PDF
Download >
 
  White Paper
  Introducing Vicor’s Converter housed in Package (ChiP) Technology
PDF
Download >
 
 
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  View
  Video
 
  Video: 2013 APEC Plenary Session with Patrizio Vinciarelli  
VIDEO
2013 APEC Plenary Session
Patrizio Vinciarelli
CEO, Vicor Corporation
 
 
  Video: Introduction to Vicor ChiP Technology  
VIDEO
An Introduction to ChiP Technology
Stephen Oliver
Vice President, VI Chip Product Line
 
 
  Video: APEC 2013  
VIDEO
APEC 2013
Gary Gill
Director, VI Chip Product Line
 
 
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  American Technology Award 2013  
 
EDN Hot 100 Products of 2013
 
 
ChiP Technology
ChiP Technology
 
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  Follow
  Press Coverage
 
  Vicor (Press Release)
  Vicor Corporation Launches New
ChiP-based DCM™ Converter Modules
 
Read >
 
  Vicor (Press Release)
  Vicor Pushes Power Density Boundaries and Introduces Digital Communication Capability with New ChiP Bus Converter Modules  
Read >
 
  Electronic Design (Article)
  400-V DC Distribution in the Data Center Gets Real  
Read >
 
  EDN (Article)
  Vicor Corporation ChiP
bus converter modules
 
Read >
 
  Vicor (Press Release)
  Vicor Corporation Delivers First ChiP Power Modules  
Read >
 
  Power Systems Design (Cover Article)
  Addressing 400-Vdc power in advanced industrial and data-center apps  
Read >
 
  Vicor (Press Release)
  Vicor’s ChiP Power Component Packaging Technology Named One of the Hot 100 Products of 2013 by UBM Tech’s EDN  
Read >
 
  EDN (Article)
  EDN Hot 100 products of 2013: Components and sensors  
Read >
 
  Electronic Design (Article)
  Next-Generation Servers Require Robust Power Platforms  
Read >
 
  Power Electronics (Article)
  New Thermal-design Options
Drive Power Density
 
Read >
 
  Vicor (Press Release)
  Vicor Corporation’s 'ChiP' Power Component Packaging Technology Honored with American Technology Award  
Read >
 
  Engineering TV (Video)
  Video interview presenting ChiP packaging technology  
Watch >
 
  Power Systems Design (Video)
  Demo of Complete AC to Point of Load Solution at PCIM  
Watch >
 
  EDN (Article)
  Vicor reveals new ChiP power package
at APEC 2013
 
Read >