Reliability Data

 
Environmental Stress Screening (ESS)  Mean Time Between Failure (MTBF)  Environmental Qualification

Environmental Stress Screening (ESS)

Every H & M-Grade Maxi, Mini, and Micro as well as MI Family modules undergoes extensive post-production environmental stress screening (ESS) before shipment to verify compliance with Vicor's high quality and performance standards and to eliminate early life failures. To ensure the most effective routine for precipitating module failures, we continually evaluate our ESS program and make appropriate changes as new data become available or as product improvements occur. After burn-in and temperature cycling, each module undergoes final electrical testing over the specified temperature range. The program is outlined below.

 

 

    MI Family Module Screening   Maxi, Mini & Micro Module Screening
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    I-Grade   M-Grade   H-Grade   M-Grade
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Operating Temperature   MI-200   MI-200   -40 to +100°C   -55 to +100°C
  -55 to +85°C   -55 to +85°C    
  MI-J00   MI-J00    
  -40 to +100°C   40 to +100°C    
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Storage Temperature   MI-200   MI-200   -55 to +120°C   -65 to +125°C
  -55 to +100°C   -65 to +100°C    
  MI-J00   MI-J00    
  -55 to +125°C   -65 to +125°C    
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Temperature Cycling   12 cycles   12 cycles   12 cycles   12 cycles
17°C per minute nominal rate of change, dwell time until product stabilization   -65 to +100°C   -65 to +100°C   -65 to +100°C   -65 to +100°C
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Ambient Test @ 25°C   Yes   Yes   Yes   Yes
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Power Cycling Burn-In   12 hours   96 hours   12 hours   24 hours
  • Power on 10 minutes
    off 15 minutes
  • Module temperature
    cycling 35°C to 80°C
  • Load up to 100 W
  • Module output continuously monitored while enabled
  29 cycles   213 cycles   29 cycles   58 cycles
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Functional & Parametric ATE TestsLow and high temperature   -40 to +85°C   -55 to +85°C   -40 to +100°C   -55 to +100°C
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Hi-Pot Test
AC or equivalent DC
  Yes   Yes   Yes   Yes
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Visual Inspection
Before packing into ESD containers
  Yes   Yes   Yes   Yes
                 
Mean Time Between Failure (MTBF)

Because operating temperature is one of the most important factors in determining overall module reliability, it is imperative that the user's system design allow for efficient heat transfer from the baseplate to system ambient. Since temperature and failure rate are exponentially related, just a 10°C decrease in baseplate temperature can have a dramatic increase in MTBF. Due to patented zero-voltage/zero-current switching topology, Vicor converters are highly efficient compared to those with more traditional topologies. High efficiency translates into both smaller size and lower temperature rises. To minimize thermal impedance, all major power dissipating components are mounted directly to the baseplate.
Below are representative calculated MTBF values based on MIL-HDBK-217F. If you require information about a specific model, contact Vicor with the model number, expected baseplate temperature, and operating environment to obtain an individually prepared report.

 

 

        MTBF in 1000 Hours
Part Number   Baseplate Temperature   G.B.   G.F.   A.I.C.   N.S.
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MI-J71-MY   25°C   3,782   1,891   1,135   1,116
    50°C   2,307   1,154   692   681
    65°C   1,778   889   533   524
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MI-274-MW   25°C   3,830   1,878   1,149   1,130
    50°C   2,336   1,915   701   689
    65°C   1,800   900   540   531
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V24C3V3M75BL   25°C   6,235   3,117   1,870   1,839
Micro Module   50°C   3,803   1,902   1,141   1,122
    65°C   2,930   1,465   879   864
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V24B5M200BL   25°C   4,205   2,102   1,201   1,240
Mini Module   50°C   2,565   1,282   769   757
    65°C   1,976   988   593   583
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V24A12M400BL   25°C   3,428   1,714   1,028   845
Maxi Module   50°C   2,091   1,282   627   617
    65°C   1,611   806   483   475
                     

 

Environmental Qualification

Fully encapsulated, Vicor Maxi, Mini, Micro, and MI family modules utilize a proprietary spin fill process that assures complete, void free encapsulation making them suitable for the harshest environments. In addition to providing mechanical rigidity, the encapsulant is thermally conductive to eliminate hot spots and aid in heat transfer to the baseplate. Modules are available with temperatures down to -55°C operating and -65°C storage.

To verify the suitability of Vicor's H & M-Grade Maxi, Mini, and Micro as well as MI Family modules for harsh environments, these products have been subjected to the environmental testing requirements of MIL-STD-810, MIL-S-901 and MIL-STD-202. These tests, listed below, are performed at an independent laboratory. Additional environmental tests can be done upon individual customer request.

 

   

 

Environment   MI Family Module   Maxi, Mini & Micro Module
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Altitude  
  • MIL-STD-810F
    Method 500.4
    Procedure I & II
    40,000 ft.and 70,000 ft. Operational
 
  • MIL-STD-810D
    Method 500.2
    Procedure III
    explosive decompression (40 K ft.)

     
  • MIL-STD-810D
    Method 500.2
    Procedure II
    40,000 ft.
    1000 – 1500 ft./min. to
    70,000 ft., unit functioning
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Explosive Atmosphere  
  • MIL-STD-810F
    Method 511.4
    Procedure I
    Operational
 
  • MIL-STD-810C
    Method 511.1
    Procedure I
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Vibration  
  • MIL-STD-810F
    Method 514.5
    Procedure I
    category 14
    sine and random vibration
    per Table 514.5C
    for helicopter AH-6J main rotor
    with overall level of 5.6 g rms
    for 4 hours per axis

     
  • MIL-STD-810F
    Method 514.5C
    general minimum
    integrity curve
    per Figure 514.5C-17
    with overall level of 7.7 g rms
    for 1 hr per axis
 
  • MIL-STD-810D
    Method 514.3
    Procedure I
    category 6
    helicopter, 20 g

     
  • MIL-STD-810D
    Method 514.3
    random:
    10 – 300 Hz @ 0.02 g2/Hz
    2000 Hz @ 0.002 g2/Hz
    3.9 total g rms
    3 hrs/axis
    sine:
    30 Hz @ 20 g
    60 Hz @ 10 g
    90 Hz @ 6.6 g
    120 Hz @ 5.0 g
    16.0 total g rms
    3 axes

     
  • MIL-STD-810E
    Method 514.4
    Table 514.4-VII
    ±6 db/octave 7.7 g rms
    1hr/axis
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Shock  
  • MIL-STD-810F
    Method 516.5
    Procedure I
    functional shock, 40 g

     
  • MIL-S-901D
    lightweight hammer shock
    3 impacts/axis,1, 3, 5 ft.

     
  • MIL-STD-202F
    Method 213B
    60 g, 9 ms half sine

     
  • MIL-STD-202F
    Method 213B
    75 g, 11 ms saw tooth shock
 
  • MIL-STD-810D
    Method 516.3
    Procedure I
    functional shock, 40 g

     
  • MIL-STD-202F
    Method 213B
    18 pulses, 60 g, 9 msec

     
  • MIL-STD-202F
    Method 213B
    75 g, 11 ms saw tooth shock

     
  • MIL-STD-202F
    Method 207A
    3 impacts / axis, 1, 3, 5 feet
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Acceleration  
  • MIL-STD-810F
    Method 513.5
    Procedure II
    Table 513.5-II
    Operational
    2 – 7 g
    6 directions
 
  • MIL-STD-810D
    Method 513.3
    Procedure II
    Operational test
    9 g for 1 minute
    along 3 mutually
    perpendicular axes
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Humidity  
  • MIL-STD-810F
    Method 507.4
    95% Relative Humidity
   
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Solder Test  
  • MIL-STD-202G
    Method 208H
    8 hr aging
   
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Fungus  
  • MIL-STD-810F
    Method 508.5
 
  • MIL-STD-810C
    Method 508.1
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Salt Fog  
  • MIL-STD-810F
    Method 509.4
 
  • MIL-STD-810C
    Method 509.1