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Vicor unveils new Vertical Power Delivery solution at 2019 AI Hardware Summit

Robert Gendron, Vicor Corporate Vice President, presented The Need for New AI Processor Power Delivery that underscored the demand for more power in AI and a more efficient way to deliver it. His talk explained the progression of the Vicor Power-on-Package solutions, which leverages Vicor Factorized Power Architecture and SM-ChiP packaging design. These solutions maximize AI processor performance by eliminating the conventional limitations in power delivery.

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