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Taipei 2019 October 2
High-Performance Power Conversion Seminar & Workshops
Maximizing 24, 48, 380V, and AC Power Designs
View Agenda Register now

Keynote speaker:
Dr. Harrison Chang

Vice President

Miniaturized Product, Corporate R&D

Advanced Semiconductor Engineering Group, Taipei Taiwan

Dr. Harrison Chang is the VP in ASE Corporate R&D heading Miniaturized Product division, focusing on the heterogeneous integration of System-in-Package for WWAN/WLAN modem, mmWave, smart phone, wearable, and automotive electronics applications. He has more than 30 technical papers and global patents. He has been an IEEE member for more than 25 years, and has been participating in the EPS society and MTT society actively. He graduated from Electrical Engineer Department, National Taiwan University in 1985. He received his Ph.D. degree on Electromagnetic from the Department of Electrical Engineering, University of Maryland, College Park in 1993. Since then, his experience includes Deputy Professor in the Huafan University, Taiwan, Senior Engineer in Qualcomm, San Diego, Associate VP in BenQ, founder and CEO of the Indigo Mobile Technologies.

Dr. Harrison Chang

開催にあたり

開催にあたり

電源システム設計は、年々複雑さを増し続けており、高性能な電力変換を実現するためには、最新の設計手法の理解が不可欠です。本セミナーのワークショップでは、DC-DC設計、AC-DCフロントエンドの設計、EMI対策、放熱設計、PCBレイアウトなどに関する最新技術を、実際のアプリケーション事例を用いながら解説します。最先端の電源システムを設計するノウハウを、ぜひこの機会にご体験ください。

また、基調講演として

大阪会場では、長崎総合科学大学 学術教授・黒川 不二雄 氏

東京会場では、神戸大学 教授・牧野 淳一郎 氏 にご講演いただきます。皆様のご来場を心よりお待ちしております。

Agenda

2019 October 2

Grand Victoria Hotel 168 Jingye 4th Road, Taipei City, Taiwan


8:30 - 9:00

Registration and technical booth open


9:00 - 9:20

Welcome


9:20 - 10:00

Keynote presentation: The growing power requirements by the AI processor

Presented by Harrison Chang, VP of Power Design, ASE


10:00 - 11:00

嵌入式高功率AC-DC設計考量

張仁程 Jeff Chang


11:00 - 11:20

Coffee/tea break and technical booth open


11:20 - 12:20

Workshop: DC-DC system design done right

Presented by Applications Engineering

Real-world systems comprise more than just the DC-DC converter itself. Using a case study to examine the requirements of module integration into a DC-DC system, you will learn topics such as input and output filtering, protections, compatibility with the source and load dynamics.


12:20 - 13:30

Lunch


13:30 - 14:30

Workshop: High-performance PCB layout and thermal design techniques

Presented by Applications Engineering

Our experts will share their optimization techniques addressing the following topics: applying thermal models and simulation, PCB layout for effective thermal management, power/signal routing and integrity in high density, high current applications to minimize board losses and maximize performance.


14:30 - 14:50

Coffee/tea break and technical booth open


14:50 - 15:50

Workshop: EMI challenges and troubleshooting techniques

Presented by Applications Engineering

Without proper consideration, EMI can derail projects and create costly delays. With a real-world troubleshooting example, you will learn about basic EMI measurement, common and differential noise sources and identification methods, conducted EMI pre-compliance testing, layout issues, etc.


15:50 - 16:30 

Demo/open discussion


Our sponsor

Mouser


Registration

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