Packaging used in product shipping
Products shipping in a clamshell
- VI-2
- VI-J
- Full Brick (Maxi)
- Half Brick (Mini)
- Quarter Brick (Micro)
- Double Brick Package (ACFE)
- 1714 VIA (AIM)(TPM)
- 3414 VIA
- 3714 VIA
- 3814 VIA (BCM)
- 4414 VIA
- 4914 VIA
- 5614 VIA
Products shipping in JEDEC trays
- Full Chip
- Half Chip
- 10 x 10 LGA SiP (Data Center PRM)
- 10 x 14 LGA SiP (Data Center PRM)
- 10.5 x 14.5 LGA SiP (MIL Buck)
- 0823 ChiP
- 1323 ChiP (Data Center VTM)
- 1714 ChiP (MFM)
- 2322 ChiP (Data Center VTM)
- 3314 ChiP (MFM)
- 3623 ChiP
- 4623 ChiP
- 6123 ChiP