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Seoul 2019 October 18
High-Performance Power Conversion Seminar & Workshops View Agenda Register now

Keynote speaker:
Prof. Ho-Young Cha

Professor, School of Electronic and Electrical Engineering

Hongik University

Prof. Ho-Young Cha received the B.S. and M.S. degrees in Electrical Engineering from the Seoul National University, Seoul, Korea, in 1996 and 1999, respectively, and the Ph.D. degree in Electrical and Computer Engineering from Cornell University, Ithaca, NY, in 2004. He was a Postdoctoral Research Associate with Cornell University until 2005, where he focused on the design and fabrication of wide bandgap semiconductor devices. He was with the General Electric Global Research Center, Niskayuna, NY, from 2005 to 2007, developing wide-bandgap semiconductor sensors and high-power devices. Since 2007, he is currently Professor in the School of Electronic and Electrical Engineering at Hongik University, Seoul, Korea. His research interests include wide-bandgap semiconductor devices such as power switching devices, RF power transistors, photodetectors, sensors, etc. He has authored over 120 publications in his research area.


2019 October 18

EL Tower 24 Yangjae-dong, Seocho-gu, Seoul, South Korea

12:30 to 1:00 PM

Registration and Technical Booth Open

1:00 to 1:20 PM

Opening Speech

1:20 to 2:00 PM

Keynote by Prof. Ho-Young Cha

This presentation summarizes technology trends in power semiconductor devices based on various semiconductor materials including silicon. Benefits and potential application areas of emerging power semiconductors will be introduced along with important technical challenges and process issues to compete with well-established silicon power devices. Outlook of current and future market positioning of different power semiconductors will be discussed.

2:00 to 2:50 PM

Workshop: Avoiding common AC-DC design pitfalls

Presented by Applications Engineering

Design-in of AC-DC front end modules can be complicated. This session will provide a straightforward approach for success, covering such topics as source impedance considerations, inrush current, filter resonance and damping, PFC, faults, fusing, system stability and safety.

2:50 to 3:05 PM

Coffee/Tea Break and Technical Booth Open

3:05 to 3:55 PM

Workshop: EMI challenges and troubleshooting techniques

Presented by Applications Engineering

Without proper consideration, EMI can derail projects and create costly delays. With a real-world troubleshooting example, you will learn about basic EMI measurement, common and differential noise sources and identification methods, conducted EMI pre-compliance testing, layout issues, etc.

3:55 to 4:45 PM

Workshop: Modular DC-DC system design done right

Presented by Applications Engineering

Real-world systems comprise more than just the DC-DC converter itself. Using a case study to examine the requirements of module integration into a DC-DC system, you will learn topics such as input and output filtering, protections, compatibility with the source and load dynamics.

4:45 to 5:35 PM

Workshop: High-performance PCB layout and thermal design techniques

Presented by Applications Engineering

Our experts will share their optimization techniques addressing the following topics: applying thermal models and simulation, PCB layout for effective thermal management, power/signal routing and integrity in high density, high current applications to minimize board losses and maximize performance.

17:35 – 18:00 PM

Q&A and Lucky Draw

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