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Innovations in Power

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Converter housed in Package "ChiP" Technology
The Converter housed in Package Technology enables you to reach higher levels of power density, up to 3000 Win3 with very high efficiency, up to 97%. This new package is very thermally adept, and allows the package to be cooled from both the top and the bottom. This new technology is setting new standards for the industry:

  • Up to 3 kW/in3 power density
  • Up to 850 W/in2 area density
  • Up to 98% efficiency
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Featured Video

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An Introduction
to Vicor’s 380 VDC
BCM Module


Gary Gill
VI Chip Product Line

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White Paper

How a transition to 400 VDC for power transmission and conversion offers tangible and significant benefits for both sourcing options and system performance. And provides a significant response to initiatives for reducing emissions of greenhouse gases, lowering energy consumption and increasing use of renewable energy sources.

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Webinars

Power Advantage Educational Program

Webinar Series: Trends, Innovations and Power Design Strategies for HVDC Distribution

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8-Part Webinar Series Presented by
Stephen Oliver VP,
VI Chip Product Line
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