Innovating power delivery networks
Every electronic piece of equipment or system has a power delivery network (PDN)
ZVS Buck Switching Regulators
12V, 24V or 48V direct to point-of-load regulators
PI33/PI34/PI35xx ZVS Buck switching regulators offer board-level designers maximum power density and flexibility for high-efficiency point-of-load DC-DC regulation. The integration of a high-performance zero-voltage switching (ZVS) topology increases point-of-load performance, providing best-in-class power efficiency up to 98%. The ZVS regulators are highly integrated with control circuitry, power semiconductors and support components, in a high-density System-in-Package (SiP). The device can also be configured to operate in constant current mode.
Some of the world most innovative companies trust Vicor compact ZVS Buck switching regulators to provider reliable regulation to their products. Read more about the world’s first commercialized hydrogen fuel cell powered UAV.
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| Part Number | Datasheet | Vin (V) | Vout (V) | Output Current (A) | Package | Mounting | Temperature | Dimensions mm | Dimensions in. | Maximum Array Size | Add to cart / view details | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Part Number: | Vin (V): 12.0 (8.0 - 18.0) |
Vout (V): 3.3 (2.3 - 4.1) |
Output Current (A): 15.0 |
Package: 14 x 10 |
Mounting: LGA-SIP |
Temperature: -40.0 - 125.0°C |
Dimensions mm: 14.0 x 10.0 x 2.6mm |
Dimensions in.: 0.5512 x 0.3937 x 0.1001in |
Maximum Array Size: 3 |
View Details | ||
| Part Number: | Vin (V): 12.0 (8.0 - 18.0) |
Vout (V): 5.0 (3.3 - 6.5) |
Output Current (A): 15.0 |
Package: 14 x 10 |
Mounting: LGA-SIP |
Temperature: -40.0 - 125.0°C |
Dimensions mm: 14.0 x 10.0 x 2.6mm |
Dimensions in.: 0.5512 x 0.3937 x 0.1001in |
Maximum Array Size: 3 |
View Details | ||
| Part Number: | Vin (V): 24.0 (8.0 - 36.0) |
Vout (V): 3.3 (2.3 - 4.1) |
Output Current (A): 10.0 |
Package: 14 x 10 |
Mounting: LGA-SIP |
Temperature: -40.0 - 125.0°C |
Dimensions mm: 14.0 x 10.0 x 2.6mm |
Dimensions in.: 0.5512 x 0.3937 x 0.1001in |
Maximum Array Size: 3 |
View Details | ||
| Part Number: | Vin (V): 24.0 (8.0 - 36.0) |
Vout (V): 5.0 (3.3 - 6.5) |
Output Current (A): 10.0 |
Package: 14 x 10 |
Mounting: LGA-SIP |
Temperature: -40.0 - 125.0°C |
Dimensions mm: 14.0 x 10.0 x 2.6mm |
Dimensions in.: 0.5512 x 0.3937 x 0.1001in |
Maximum Array Size: 3 |
View Details | ||
| Part Number: | Vin (V): 24.0 (11.0 - 36.0) |
Vout (V): 5.0 (3.3 - 6.5) |
Output Current (A): 15.0 |
Package: 14 x 10 |
Mounting: LGA-SIP |
Temperature: -40.0 - 125.0°C |
Dimensions mm: 14.0 x 10.0 x 2.6mm |
Dimensions in.: 0.5512 x 0.3937 x 0.1001in |
Maximum Array Size: 3 |
View Details | ||
| Part Number: | Vin (V): 24.0 (14.0 - 42.0) |
Vout (V): 3.3 (2.2 - 4.0) |
Output Current (A): 22.0 |
Package: 14 x 10 |
Mounting: LGA-SIP |
Temperature: -55.0 - 125.0°C |
Dimensions mm: 14.0 x 10.0 x 2.6mm |
Dimensions in.: 0.5512 x 0.3937 x 0.1001in |
Maximum Array Size: 3 |
View Details | ||
| Part Number: | Vin (V): 24.0 (14.0 - 42.0) |
Vout (V): 5.0 (4.0 - 6.5) |
Output Current (A): 20.0 |
Package: 14 x 10 |
Mounting: LGA-SIP |
Temperature: -40.0 - 120.0°C |
Dimensions mm: 14.0 x 10.0 x 2.6mm |
Dimensions in.: 0.5512 x 0.3937 x 0.1001in |
Maximum Array Size: 3 |
View Details | ||
| Part Number: | Vin (V): 24.0 (17.4 - 36.0) |
Vout (V): 12.0 (6.5 - 13.0) |
Output Current (A): 8.0 |
Package: 14 x 10 |
Mounting: LGA-SIP |
Temperature: -40.0 - 125.0°C |
Dimensions mm: 14.0 x 10.0 x 2.6mm |
Dimensions in.: 0.5512 x 0.3937 x 0.1001in |
Maximum Array Size: 3 |
View Details | ||
| Part Number: | Vin (V): 24.0 (20.4 - 36.0) |
Vout (V): 15.0 (10.0 - 16.0) |
Output Current (A): 8.0 |
Package: 14 x 10 |
Mounting: LGA-SIP |
Temperature: -40.0 - 125.0°C |
Dimensions mm: 14.0 x 10.0 x 2.6mm |
Dimensions in.: 0.5512 x 0.3937 x 0.1001in |
Maximum Array Size: 3 |
View Details | ||
| Part Number: | Vin (V): 48.0 (30.0 - 60.0) |
Vout (V): 3.3 (2.2 - 4.0) |
Output Current (A): 22.0 |
Package: 14 x 10 |
Mounting: LGA-SIP |
Temperature: -40.0 - 120.0°C |
Dimensions mm: 14.0 x 10.0 x 2.6mm |
Dimensions in.: 0.5512 x 0.3937 x 0.1001in |
Maximum Array Size: 3 |
View Details | ||
| Part Number: | Vin (V): 48.0 (30.0 - 60.0) |
Vout (V): 5.0 (4.0 - 6.5) |
Output Current (A): 20.0 |
Package: 14 x 10 |
Mounting: LGA-SIP |
Temperature: -40.0 - 120.0°C |
Dimensions mm: 14.0 x 10.0 x 2.6mm |
Dimensions in.: 0.5512 x 0.3937 x 0.1001in |
Maximum Array Size: 3 |
View Details | ||
| Part Number: | Vin (V): 48.0 (30.0 - 60.0) |
Vout (V): 12.0 (6.5 - 14.0) |
Output Current (A): 18.0 |
Package: 14 x 10 |
Mounting: LGA-SIP |
Temperature: -40.0 - 120.0°C |
Dimensions mm: 14.0 x 10.0 x 2.6mm |
Dimensions in.: 0.5512 x 0.3937 x 0.1001in |
Maximum Array Size: 3 |
View Details | ||
| Part Number: | Vin (V): 48.0 (36.0 - 60.0) |
Vout (V): 5.0 (4.0 - 5.5) |
Output Current (A): 10.0 |
Package: 10 x 10 |
Mounting: LGA-SIP |
Temperature: -40.0 - 125.0°C |
Dimensions mm: 10.0 x 10.0 x 2.6mm |
Dimensions in.: 0.5512 x 0.3937 x 0.1001in |
Maximum Array Size: 3 |
View Details | ||
| Part Number: | Vin (V): 48.0 (36.0 - 60.0) |
Vout (V): 12.0 (6.5 - 14.0) |
Output Current (A): 9.0 |
Package: 10 x 10 |
Mounting: LGA-SIP |
Temperature: -40.0 - 125.0°C |
Dimensions mm: 10.0 x 10.0 x 2.6mm |
Dimensions in.: 0.5512 x 0.3937 x 0.1001in |
Maximum Array Size: 3 |
View Details | ||
Power System Designer
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Features and Benefits
Features and benefits
Wide operating range
Simple to use; fast development time
High efficiency
Flexible and rich feature set
Watch the Mouser video that outlines the technical advantages of the PI3523 point-of-load regulator
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High-Performance ZVS Buck Regulator Removes Barriers to Increased Power Throughput in Wide-Input-Range Point-of-Load Applications
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Resources
Resources for the design engineer
Advanced power module packaging optimizes available power, reliability and safety in autonomous electric shuttles
Vicor high-efficiency power modules ensure minimal heat dissipation, reducing the need for complex cooling solutions and maximizing power
Optimizing high-density power design: modular vs. discrete
There are several important design variables to consider when evaluating the power module design process
Modular power delivery networks for UAVs
The key challenge we see facing engineers today is the demand for smaller, lighter-weight designs that deliver higher power
- DC-DC transformer facilitates implementation of longer tether
- Low weight, low noise solution for sewer inspection robots
- More power within the same space for machine vision systems
- High density power allows for unobtrusive, 5G indoor small-cell base station
- 4G remote radio unit extends mobile signal coverage in remote areas
- A fanless power solution gives antenna array fast, reliable data coverage
- Conduction-cooling solution allows for truly portable network test equipment
- Remote radio units better distribute traffic while operating under fault conditions
- A wide-input voltage range allows full utilization of the battery, which extended the range of the UAVs
- Avionic equipment operates simultaneously from multiple power sources in extreme temps without fans
- Direct infrared countermeasure's optical circuitry runs cooler while meeting stringent EMI specs
- MIL-STD power components withstand mechanical stresses caused by vibration and acceleration in helicopter gearboxes
- Improved efficiency of the power supply allows high temp operation in RF signal intelligence
- Image stability for the gimbal system improves vehicle-mounted optical sights
- Enormous video wall display becomes feasible with a move to component-enabled, higher voltage bus
- The rugged environment for Bus Wi-Fi gets an efficient and reliable power
- Different vehicle voltages is accommodated by one solution for digital video recorders
- Scalable power solutions allow marine instrumentation to keep precision while operating in extreme environments
- Power supply size reduction allows for additional medical diagnostic equipment functionality within the same footprint
- Power solution operates in extreme temperatures for LEDs to display brighter lights, longer
- Speed, precision, resolution and contrast of engraving lasers is improved using wide-input and output-range regulators
- Scientific instrumentation gets twice the power without impacting the size of the equipment
- Decreased weight and size of the power source enables the payload increase of tethered robots
- Managing the heat of the power supply makes rail signaling more reliable
- Slowed ramp-up process relieves stress of the power supply during startup in vehicle mounted advertising displays
- PI33xx and PI34xx series
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Get more documents, videos and case studies in the resource library for engineers
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