Redefining power delivery networks with fixed‑ratio converters
This white paper discusses the fixed ratio, DC DC converter and why designers should consider it an essential part of the power delivery architecture
NBM™ Non-isolated Bus Converter Module
Bidirectional power converters
NBMs are fixed ratio (non-regulating) non-isolated, bidirectional DC-DC converters. These patented high-performance power modules provide a complete DC-DC solution and do not require an external input filter or bulk capacitors. In addition, the NBM2317 features built-in hot-swap capability and inrush current limiting. Fast transient response is supported by the NBM’s low output impedance. The NBM family of converters are available in through-hole Converter housed in Package (ChiP™) and Surface Mount (SM-ChiP™) board-mount packages. All manufacturing is performed in the Vicor state-of-the-art ChiP™ fab located in Andover, Massachusetts.
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| Part Number | Datasheet | Input (V) | Output (V) | Output Current (A) | K Factor | Control Interface | Max Capacitance (μF) | Mounting | Temperature | Dimensions mm | Dimensions in. | Package | Add to cart / view details | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Part Number: | Input (V): 40.0 - 60.0 |
Output (V): 10.0 - 15.0 |
Output Current (A): 65.0 |
K Factor: 1/4 |
Control Interface: Analog |
Max Capacitance (μF): 3000 |
Mounting: Surface Mount |
Temperature: -40 to +125°C |
Dimensions mm: 22.80 x 17.30 x 5.20mm |
Dimensions in.: 0.90 x 0.68 x 0.20in |
Package: 2317 SM-ChiP |
View Details | ||
| Part Number: | Input (V): 40.0 - 60.0 |
Output (V): 10.0 - 15.0 |
Output Current (A): 80.0 |
K Factor: 1/4 |
Control Interface: Analog |
Max Capacitance (μF): 3000 |
Mounting: Surface Mount |
Temperature: -40 to +125°C |
Dimensions mm: 22.80 x 17.30 x 5.20mm |
Dimensions in.: 0.90 x 0.68 x 0.20in |
Package: 2317 SM-ChiP |
View Details | ||
| Part Number: | Input (V): 36.0 - 46.0 |
Output (V): 12.0 - 15.3 |
Output Current (A): 160.0 |
K Factor: 1/3 |
Control Interface: Analog |
Max Capacitance (μF): 3000 |
Mounting: Through Hole |
Temperature: -55 to +125°C |
Dimensions mm: 61.00 x 25.14 x 7.21mm |
Dimensions in.: 2.40 x 0.99 x 0.28in |
Package: 6123 ChiP |
View Details | ||
| Part Number: | Input (V): 36.0 - 46.0 |
Output (V): 12.0 - 15.3 |
Output Current (A): 160.0 |
K Factor: 1/3 |
Control Interface: Analog |
Max Capacitance (μF): 3000 |
Mounting: Through Hole |
Temperature: -40 to +125°C |
Dimensions mm: 61.00 x 25.14 x 7.21mm |
Dimensions in.: 2.40 x 0.99 x 0.28in |
Package: 6123 ChiP |
View Details | ||
| Part Number: | Input (V): 36.0 - 60.0 |
Output (V): 7.2 - 12.0 |
Output Current (A): 170.0 |
K Factor: 1/5 |
Control Interface: Analog |
Max Capacitance (μF): 3000 |
Mounting: Through Hole |
Temperature: -40 to +125°C |
Dimensions mm: 61.00 x 25.14 x 7.21mm |
Dimensions in.: 2.40 x 0.99 x 0.28in |
Package: 6123 ChiP |
View Details | ||
Power System Designer
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Output
Min output:
Minimum output:
Nom output:
Nominal output:
Max output:
Maximum output:
Features and Benefits
Features and benefits
High efficiency >98%
High power density of up to 3,600W/in3
Parallel operation for multi‑kW arrays
Bidirectional capability
Watch the Digi-Key video that outlines the technical advantages of the NBM2317
Resources
Resources for the design engineer
Attributes of high‑performance power module packaging
Power module packaging, has been a unique differentiator for Vicor since its inception
Innovating power delivery networks
Vicor is innovating with power delivery networks. Improving end-system performance requires innovative power technologies
Advanced power module packaging optimizes available power, reliability and safety in autonomous electric shuttles
Vicor high-efficiency power modules ensure minimal heat dissipation, reducing the need for complex cooling solutions and maximizing power
- AN:001 – Configuring the Vicor BCM with Low Power niPOLs
- AN:016 – Using BCM Bus Converters in High Power Arrary
- AN:031 – Through-Hole ChiP Package Soldering Guidelines
- AN:036 – Recommendations for Maximum Compressive Force of Heat Sinks
- AN:039 – Thermal Management for VIA and ChiP Modules
- AN:701 – SM-ChiP™Reflow Soldering Recommendations
6123 ChiP
- cURus – UL 60950-1, CSA 60950-1
- cTÜVus – EN 62368-1, UL 62368-1, CSA 62368-1
- CE Mark – Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU)
- CB Certificate – IEC 62368-1
- cURus – UL 60950-1, CSA 60950-1
- cTÜVus – EN 62368-1, UL 62368-1, CSA 62368-1
- CE Mark – Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU)
- CB Certificate – IEC 62368-1
- UKCA – The Electrical Equipment (Safety) Regulations 2016, SI 2016 No. 1101 and Restriction of Hazardous Substances SI 2012, No. 3032
For California residents see information regarding California Proposition 65
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