Presented by Siyu Chai, Product Manager Global AI/Computing Market, Vicor

Leveraging a Factorized Power Architecture (FPA) and current multiplication, Vicor provides solutions for lateral power delivery, vertical power delivery and a new solution, lateral-vertical power delivery. Siyu addressed the problem of impedances and their effects on PDN losses in relation to the processor core voltages. Advances in power module packaging, next generation current multiplication and current density was also be addressed. These technologies enable wafer scale and clustered computing AI systems with current requirements in the tens of thousands of amps and will unleash xPU performance. The presentation deck is available to download.