The future of standardized defense platforms using MOSA, SOSA and VPX open architectures
MegaMod™ / MegaMod™ Jr. Chassis-Mount DC-DC Converters
The MegaMod and MegaMod Jr. families of single-, dual- and triple-output
Power System Designer
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Output
Min output:
Minimum output:
Nom output:
Nominal output:
Max output:
Maximum output:
Features and Benefits
Features and benefits
Chassis-mount DC-DC converters
Low-noise ZCS / ZVS power architecture
Booster versions available for higher versions
Single, dual, or triple outputs
Resources
Resources for the design engineer
Delivering higher power density and low noise for New Space applications
Patented power design techniques and architectures needed to deliver optimal power and low noise for space communications applications
Macnica online seminar 2025
Learn about heat dissipation methods and thermal design with power modules
Attributes of high‑performance power module packaging
Power module packaging, has been a unique differentiator for Vicor since its inception
- Soldering Methods and Procedures for Vicor Power Modules
- Designing a Power Supply with Multiple Input Options
- Creating High Voltage Outputs
- AN:201 - Using Modular DC-DC Converters to Meet European Standards for Railway Applications
- Current Share Board
- Constant Current Control for DC-DC Converters
- Undervoltage / Overvoltage Lockouts
- VI-200, VI-J00 Design Guide and Applications Manual
- VI-200, VI-J00 Design Guide and Applications Manual
- 1. Zero-Current Switching
- 1. Zero-Current Switching
- 2. DC-DC Converter Pinouts
- 3. Module Dos and Donts
- 4. Overcurrent Protection
- 5. Output Voltage Trimming
- 6. Multiple Gate In Connections
- 7. Applications Circuits / Converter Array Design Considerations
- 8. Using Boosters and Parallel Arrays
- 9. EMC Considerations
- 10. Optional Output Filters
- 11. Battery Charger (BatMod)
- 12. AC Input Module (AIM / MI-AIM)
- 12. AC Input Module (AIM / MI-AIM)
- 13. Harmonic Attenuator Module (HAM)
- 14. Input Attenuator Module (IAM / MI-IAM)
- 15. Ripple Attenuator Module (RAM / MI-RAM)
- 16. Offline Front End
- 17. DC Input Power System (ComPAC / MI-ComPAC Family)
- 17. DC Input Power System (ComPAC / MI-ComPAC Family)
- 18. AC Input Power System (FlatPAC Family)
- 19. AC Input Power System (PFC FlatPAC)
- 20. Thermal and Module Mounting Considerations
- 20. Thermal and Module Mounting Considerations
- 21. Thermal Curves
- 22. Lead Free Pins (RoHS)
- 23. Tin Lead Pins
- 24. Module Packaging Options (SlimMod, FinMod, BusMod and MegaMod Families)
- 25. Product Weights
- 26. Glossary of Technical Terms
- cURus – UL 60950-1, CSA 60950-1
- cTÜVus – EN 60950-1, UL 60950-1, CSA 60950-1
- CE Marked - Low Voltage Directive (2014/35/EC)
- CE Marked – Low Voltage Directive (2014/35/EC) and RoHS Recast Directive (2011/65/EU)
MegaMod Jr.
- cURus – UL 60950-1, CSA 60950-1
- cTÜVus – EN 60950-1, UL 60950-1, CSA 60950-1
- CE Marked – Low Voltage Directive (2014/35/EU)
- CE Marked – Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU)
- CB Certificate – IEC 60950-1
For California residents see information regarding California Proposition 65
- Trim resistors for fixed output voltage trimming
- Trim resistors for variable output voltage trimming
- Trim resistors for setting float voltage and charge current in battery chargers designed with BatMod modules
- Holdup capacitors for use with ARM modules
- Thermal impedance calculator
- Thermal data and heat sink selection tool
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