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OCP China Day 2022

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New Vicor innovations will unleash xPU performance at OCP China Day 2022

Vicor will share its new, innovative approach to solving today’s toughest high performance computing challenges.  Siyu Chai, Product Manager for global AI/computing market will present “Current Multiplier Technology Advances Enable New AI Processor Power Solutions” at OCP China Day 2022 on August 10 in Beijing, China.

While top xPUs have the capacity to the support today’s most rigorous applications, the power source limits the overall system performance.  As AI processor power levels continue to rise and core voltages decreasing with advanced process nodes, it’s causing ever-increasing PDN impedance voltage drops and power losses.  This limits processor effeteness.

Leveraging a Factorized Power Architecture (FPA) and current multiplication, Vicor provides solutions for lateral power delivery, vertical power delivery and a new solution, lateral-vertical power delivery.  Chai will address the problem of impedances and their effects on PDN losses in relation to the processor core voltages. Advances in power module packaging, next generation current multiplication and current density will also be addressed.  These technologies enable wafer scale and clustered computing AI systems with current requirements in the tens of thousands of amps.

Stop by Vicor’s booth to see a demonstration of our innovative power delivery solutions for AI and machine learning applications, some which use advanced cooling techniques. Vicor technology experts will be available to discuss advanced point-of-load, lateral, vertical and lateral-vertical power delivery solutions, which unleash xPU performance.

Current multiplier technology advances enable new AI processor power solutions

Date: August 10, 2022
Location: Beijing Kerry Hotel, China
Track1: Open Data Center Infrastructure, 15:40-16:10

Presented by Siyu Chai
Product Manager, Global AI/computing Market, Vicor

Siyu Chai

Ms. Chai has served in her current role since September, 2021 as a Product Manager for global AI/computing market. Ms. Chai served as Business Development Engineer in EMEA from 2018 to 2021. Prior to joining Vicor, Ms. Chai served as a power electronics engineer in the automotive industry for powertrain system integration of DC/DC converter and on-board charger. She holds a M.S. in Electrical Engineering from Politecnico di Milano (Polytechnic of Milan) in Italy, and she worked as a guest researcher at University of Aachen in Germany for automated power system. schai@vicorpower.com

About OCP China Day

OCP China Day is a platform to connect members of the OCP global community, Hosted by OCP Foundation, the world's most influential open computing organization. Aims to gather community members, promote technology exchanges, share results, focusing on cutting-edge technology topics such as artificial intelligence, edge computing and networks. Register to join the OCP China Day right now.

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