
High‑performance PCB layout and thermal design
This workshop will cover important aspects of PCB design to maximize heat transfer and minimize power delivery impedance and losses
This product is not recommended for new designs.
Please use the Power System Designer tool to find a product for your project.
The LoPAC family consists of three ultra-low-profile, fan-cooled, switching power supplies that combine the advantage of power-factor correction (PFC) with high-power density. All units feature universal input and accept voltages from
User-configurable supplies with one to six outputs dependent on model
Protective features: inrush limiting, transient protection and EMI filtering
Fan-cooled power supplies with high-power density
Fully compliant with global standards
New configurations are not available. Please use the Power System Designer below to find a product for your project.
High‑performance PCB layout and thermal design
This workshop will cover important aspects of PCB design to maximize heat transfer and minimize power delivery impedance and losses
Modular DC-DC system design done right
You will learn topics such as input and output filtering, protections, compatibility with the source and load dynamics
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