How is Dragonfly’s new hover-in-place tethered UAV defying maritime communication limits?
DPI tethered UAV lifts communication antennas up to 500+ feet and can increase line of site communication at sea 3x, from 8 to nearly 30 miles
Rugged factorized power solutions
The
PRM Features and Benefits
PRM features and benefits
Power density up to 312W/in3
1.3MHz switching frequency
95% efficiency
ZVS buck-boost regulation
VTM Features and Benefits
VTM features and benefits
Isolated 1 – 50V output
Fast transient response
3MHz switching frequency
Up to 96.5% efficiency
Select a PRM
0 Products
| Vin (V) | Vout (V) | Output Power (W) | Package | Add to cart / view details | ||
|---|---|---|---|---|---|---|
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Vin (V): 48 (38-55) | Vout (V): 48 (20-55) | Output Power (W): 500 | Package: Full Chip | View details | |
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Vin (V): 48 (38-55) | Vout (V): 48 (20-55) | Output Power (W): 250 | Package: Half Chip | View details | |
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Vin (V): 28 (14-50) | Vout (V): 36 (26-50) | Output Power (W): 200 | Package: Full Chip | View details | |
Select a VTM
0 Products
| Vin (V) | Vout (V) | Output Currents (A) | Package | Add to cart / view details | ||
|---|---|---|---|---|---|---|
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Vin (V): 36 (26-50) | Vout (V): 2.25 (1.63-3.13) | Output Currents (A): 55 | Package: Full Chip | View details | |
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Vin (V): 36 (26-50) | Vout (V): 4.50 (3.25-6.25) | Output Currents (A): 27 | Package: Full Chip | View details | |
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Vin (V): 36 (26-50) | Vout (V): 6.00 (4.33-8.33) | Output Currents (A): 20 | Package: Full Chip | View details | |
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Vin (V): 36 (26-50) | Vout (V): 7.20 (5.20-10.0) | Output Currents (A): 17 | Package: Full Chip | View details | |
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Vin (V): 36 (26-50) | Vout (V): 9.00 (6.50-12.50) | Output Currents (A): 13 | Package: Full Chip | View details | |
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Vin (V): 36 (26-50) | Vout (V): 12.00 (8.67-16.70) | Output Currents (A): 10 | Package: Full Chip | View details | |
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Vin (V): 36 (26-50) | Vout (V): 18.00 (13.00-25.00) | Output Currents (A): 7.0 | Package: Full Chip | View details | |
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Vin (V): 36 (26-50) | Vout (V): 24.00 (17.30-33.30) | Output Currents (A): 5.0 | Package: Full Chip | View details | |
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Vin (V): 36 (26-50) | Vout (V): 36.00 (26.00-50.00) | Output Currents (A): 3.0 | Package: Full Chip | View details | |
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Vin (V): 36 (26-50) | Vout (V): 3.00 (1.63-3.13) | Output Currents (A): 25 | Package: Half Chip | View details | |
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Vin (V): 36 (26-50) | Vout (V): 4.50 (3.25-6.25) | Output Currents (A): 20 | Package: Half Chip | View details | |
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Vin (V): 36 (26-50) | Vout (V): 9.00 (6.50-12.5) | Output Currents (A): 10 | Package: Half Chip | View details | |
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Vin (V): 36 (26-50) | Vout (V): 3.00 (2.17-4.17) | Output Currents (A): 40 | Package: Full Chip | View details | |
Power System Designer
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Resources
Resources for the design engineer
High‑performance PCB layout and thermal design
This workshop will cover important aspects of PCB design to maximize heat transfer and minimize power delivery impedance and losses
Modular DC-DC system design done right
You will learn topics such as input and output filtering, protections, compatibility with the source and load dynamics
Now boarding the flight to the future, flying lower emissions Ampaire hybrid-electric planes
Ampaire is developing hybrid-electric aircraft that will lead the industry to an all-electric future with net-zero emissions and a greener future
- AN:005 FPA Printed Circuit Board Layout Guidelines
- AN:009 SMT J-Lead VI Chip Soldering Recommendations (For surface mount full and half VI Chip packages)
- AN:017 SMT RoHS-Compliant Through-Hole VI Chip Soldering Recommendations(For through-hole full VI Chip packages)
- AN:022 MIL EMI and Transient Solutions
- AN:032 Designing High Power Parallel Arrays with PRMs
- AN:033 Fault Management Circuit
- AN:034 Creating Higher Voltage Outputs using Series Connected Sine Amplitude Converters
Full-Chip PRM
- cURus - UL 60950-1, CSA 60950-1
- cTÜVus - EN 60950-1, UL 60950-1, CSA 60950-1
- CE Marked - Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU)
- CB Certificate - IEC 60950-1
- cURus - UL 60950-1, CSA 60950-1
- cTÜVus - EN 60950-1, UL 60950-1, CSA 60950-1
- CE Marked - Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU)
- CB Certificate - IEC 60950-1
- cURus - UL 60950-1, CSA 60950-1
- cTÜVus - EN 60950-1, UL 60950-1, CSA 60950-1
- CE Marked - Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU)
- CB Certificate - IEC 60950-1
- cURus - UL 60950-1, CSA 60950-1
- cTÜVus - EN 60950-1, UL 60950-1, CSA 60950-1
- CE Marked - Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU)
- CB Certificate - IEC 60950-1
For California residents see information regarding California Proposition 65
- PRM - Full Chip J-Lead Product 3-D Model Drawing
IGS STP - PRM - Full Chip Through-Hole Product 3-D Model Drawing
IGS STP - PRM - Half Chip J-Lead Product 3-D Model Drawing
IGS STP - VTM - Full Chip J-Lead Product 3-D Model Drawing
IGS STP - VTM - Full Chip Through-Hole Product 3-D Model Drawing
IGS STP - VTM - Half Chip J-Lead Product 3-D Model Drawing
IGS STP
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Get more documents, videos and case studies in the resource library for engineers
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