High‑performance PCB layout and thermal design
Rugged factorized power solutions
The
PRM Features and Benefits
PRM features and benefits
Power density up to 312W/in3
1.3MHz switching frequency
95% efficiency
ZVS buck-boost regulation
VTM Features and Benefits
VTM features and benefits
Isolated 1 – 50V output
Fast transient response
3MHz switching frequency
Up to 96.5% efficiency
Select a PRM
0 Products
| Vin (V) | Vout (V) | Output Power (W) | Package | Add to cart / view details | ||
|---|---|---|---|---|---|---|
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Vin (V): 48 (38-55) | Vout (V): 48 (20-55) | Output Power (W): 500 | Package: Full Chip | Details | |
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Vin (V): 48 (38-55) | Vout (V): 48 (20-55) | Output Power (W): 250 | Package: Half Chip | Details | |
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Vin (V): 28 (14-50) | Vout (V): 36 (26-50) | Output Power (W): 200 | Package: Full Chip | Details | |
Select a VTM
0 Products
| Vin (V) | Vout (V) | Output Currents (A) | Package | Add to cart / view details | ||
|---|---|---|---|---|---|---|
|
Vin (V): 36 (26-50) | Vout (V): 2.25 (1.63-3.13) | Output Currents (A): 55 | Package: Full Chip | Details | |
|
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Vin (V): 36 (26-50) | Vout (V): 4.50 (3.25-6.25) | Output Currents (A): 27 | Package: Full Chip | Details | |
|
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Vin (V): 36 (26-50) | Vout (V): 6.00 (4.33-8.33) | Output Currents (A): 20 | Package: Full Chip | Details | |
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Vin (V): 36 (26-50) | Vout (V): 7.20 (5.20-10.0) | Output Currents (A): 17 | Package: Full Chip | Details | |
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Vin (V): 36 (26-50) | Vout (V): 9.00 (6.50-12.50) | Output Currents (A): 13 | Package: Full Chip | Details | |
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Vin (V): 36 (26-50) | Vout (V): 12.00 (8.67-16.70) | Output Currents (A): 10 | Package: Full Chip | Details | |
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Vin (V): 36 (26-50) | Vout (V): 18.00 (13.00-25.00) | Output Currents (A): 7.0 | Package: Full Chip | Details | |
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Vin (V): 36 (26-50) | Vout (V): 24.00 (17.30-33.30) | Output Currents (A): 5.0 | Package: Full Chip | Details | |
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|
Vin (V): 36 (26-50) | Vout (V): 36.00 (26.00-50.00) | Output Currents (A): 3.0 | Package: Full Chip | Details | |
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Vin (V): 36 (26-50) | Vout (V): 3.00 (1.63-3.13) | Output Currents (A): 25 | Package: Half Chip | Details | |
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Vin (V): 36 (26-50) | Vout (V): 4.50 (3.25-6.25) | Output Currents (A): 20 | Package: Half Chip | Details | |
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Vin (V): 36 (26-50) | Vout (V): 9.00 (6.50-12.5) | Output Currents (A): 10 | Package: Half Chip | Details | |
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|
Vin (V): 36 (26-50) | Vout (V): 3.00 (2.17-4.17) | Output Currents (A): 40 | Package: Full Chip | Details | |
and
Power System Designer
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Output specifications:
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Resources
Resources for the design engineer
- AN:005 FPA Printed Circuit Board Layout Guidelines
- AN:009 SMT J-Lead VI Chip Soldering Recommendations (For surface mount full and half VI Chip packages)
- AN:017 SMT RoHS-Compliant Through-Hole VI Chip Soldering Recommendations(For through-hole full VI Chip packages)
- AN:022 MIL EMI and Transient Solutions
- AN:032 Designing High Power Parallel Arrays with PRMs
- AN:033 Fault Management Circuit
- AN:034 Creating Higher Voltage Outputs using Series Connected Sine Amplitude Converters
Full-Chip PRM
- cURus - UL 60950-1, CSA 60950-1
- cTÜVus - EN 60950-1, UL 60950-1, CSA 60950-1
- CE Marked - Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU)
- CB Certificate - IEC 60950-1
- cURus - UL 60950-1, CSA 60950-1
- cTÜVus - EN 60950-1, UL 60950-1, CSA 60950-1
- CE Marked - Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU)
- CB Certificate - IEC 60950-1
- cURus - UL 60950-1, CSA 60950-1
- cTÜVus - EN 60950-1, UL 60950-1, CSA 60950-1
- CE Marked - Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU)
- CB Certificate - IEC 60950-1
- cURus - UL 60950-1, CSA 60950-1
- cTÜVus - EN 60950-1, UL 60950-1, CSA 60950-1
- CE Marked - Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU)
- CB Certificate - IEC 60950-1
For California residents see information regarding California Proposition 65
- PRM - Full Chip J-Lead Product 3-D Model Drawing
IGS STP - PRM - Full Chip Through-Hole Product 3-D Model Drawing
IGS STP - PRM - Half Chip J-Lead Product 3-D Model Drawing
IGS STP - VTM - Full Chip J-Lead Product 3-D Model Drawing
IGS STP - VTM - Full Chip Through-Hole Product 3-D Model Drawing
IGS STP - VTM - Half Chip J-Lead Product 3-D Model Drawing
IGS STP
Promo Component
Get more documents, videos and case studies in the resource library for engineers
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