Redefining power delivery networks with fixed‑ratio converters
This white paper discusses the fixed ratio, DC DC converter and why designers should consider it an essential part of the power delivery architecture
VTM™ Current Multiplier
Factorized power current multiplier
The VTM is a family of fixed ratio, isolated or non-isolated DC-DC transformer modules — also referred to as Point-of-Load (PoL) current multipliers. VTMs operate from a regulated primary bus to deliver a wide range of isolated outputs. A proprietary multi-megahertz ZCS/ZVS Sine Amplitude Converter™ (SAC™) topology transforms input voltages down to fractional voltages very efficiently for applications with demanding load and high-density requirements.
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| Part Number | Datasheet | Vin (V) | Vout (V) | Output Current (A) | K Factor | Mounting | Temperature | Dimensions mm | Dimensions in. | Package | Add to cart / view details | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Part Number: | Vin (V): 40 (26 - 55) |
Vout (V): 1.0 (0.7 - 1.4) |
Output Current (A): 130.0 |
K Factor: 1/40 |
Mounting: J-Lead |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 4.0 (2.2 - 4.6) |
Output Current (A): 50.0 |
K Factor: 1/12 |
Mounting: J-Lead |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 4.0 (2.2 - 4.6) |
Output Current (A): 50.0 |
K Factor: 1/12 |
Mounting: J-Lead |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 6.0 (3.3 - 6.9) |
Output Current (A): 40.0 |
K Factor: 1/8 |
Mounting: J-Lead |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 6.0 (3.3 - 6.9) |
Output Current (A): 46.0 |
K Factor: 1/8 |
Mounting: J-Lead |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 8.0 (4.3 - 9.2) |
Output Current (A): 30.0 |
K Factor: 1/6 |
Mounting: J-Lead |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 9.6 (5.2 - 11.0) |
Output Current (A): 25.0 |
K Factor: 1/5 |
Mounting: J-Lead |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 12.0 (6.5 - 13.8) |
Output Current (A): 25.0 |
K Factor: 1/4 |
Mounting: J-Lead |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 12.0 (6.5 - 13.8) |
Output Current (A): 25.0 |
K Factor: 1/4 |
Mounting: J-Lead |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 16.0 (8.7 - 18.3) |
Output Current (A): 15.0 |
K Factor: 1/3 |
Mounting: J-Lead |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 24.0 (13.0 - 27.5) |
Output Current (A): 12.5 |
K Factor: 1/2 |
Mounting: J-Lead |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 32.0 (17.3 - 36.7) |
Output Current (A): 9.4 |
K Factor: 2/3 |
Mounting: J-Lead |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 48.0 (26.0 - 55.0) |
Output Current (A): 6.3 |
K Factor: 1 |
Mounting: J-Lead |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 42 (26 - 55) |
Vout (V): 3.5 (2.2 - 4.6) |
Output Current (A): 25.0 |
K Factor: 1/12 |
Mounting: J-Lead |
Temperature: -40 to +125°C |
Dimensions mm: 22.0 x 16.5 x 6.73mm |
Dimensions in.: 0.65 x 0.866 x 0.249in |
Package: Half Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 6.0 (3.3 - 6.9) |
Output Current (A): 20.0 |
K Factor: 1/8 |
Mounting: J-Lead |
Temperature: -55 to +125°C |
Dimensions mm: 22.0 x 16.5 x 6.73mm |
Dimensions in.: 0.65 x 0.866 x 0.249in |
Package: Half Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 6.0 (3.2 - 6.9) |
Output Current (A): 20.0 |
K Factor: 1/8 |
Mounting: J-Lead |
Temperature: -40 to +125°C |
Dimensions mm: 22.0 x 16.5 x 6.73mm |
Dimensions in.: 0.65 x 0.866 x 0.249in |
Package: Half Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 12.0 (6.5 - 13.8) |
Output Current (A): 10.0 |
K Factor: 1/4 |
Mounting: J-Lead |
Temperature: -55 to +125°C |
Dimensions mm: 22.0 x 16.5 x 6.73mm |
Dimensions in.: 0.65 x 0.866 x 0.249in |
Package: Half Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 12.0 (6.5 - 13.8) |
Output Current (A): 10.0 |
K Factor: 1/4 |
Mounting: J-Lead |
Temperature: -40 to +125°C |
Dimensions mm: 22.0 x 16.5 x 6.73mm |
Dimensions in.: 0.65 x 0.866 x 0.249in |
Package: Half Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 4.0 (2.2 - 4.6) |
Output Current (A): 50.0 |
K Factor: 1/12 |
Mounting: Through Hole |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 4.0 (2.2 - 4.6) |
Output Current (A): 50.0 |
K Factor: 1/12 |
Mounting: Through Hole |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 6.0 (3.3 - 6.9) |
Output Current (A): 40.0 |
K Factor: 1/8 |
Mounting: Through Hole |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 8.0 (4.3 - 9.2) |
Output Current (A): 30.0 |
K Factor: 1/6 |
Mounting: Through Hole |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 9.6 (5.2 - 11.0) |
Output Current (A): 25.0 |
K Factor: 1/5 |
Mounting: Through Hole |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 12.0 (6.5 - 13.8) |
Output Current (A): 25.0 |
K Factor: 1/4 |
Mounting: Through Hole |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 12.0 (6.5 - 13.8) |
Output Current (A): 25.0 |
K Factor: 1/4 |
Mounting: Through Hole |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 16.0 (8.7 - 18.3) |
Output Current (A): 15.0 |
K Factor: 1/3 |
Mounting: Through Hole |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 24.0 (13.0 - 27.5) |
Output Current (A): 12.5 |
K Factor: 1/2 |
Mounting: Through Hole |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 32.0 (17.3 - 36.7) |
Output Current (A): 9.4 |
K Factor: 2/3 |
Mounting: Through Hole |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 48.0 (26.0 - 55.0) |
Output Current (A): 6.25 |
K Factor: 1 |
Mounting: Through Hole |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 40 (0 - 60) |
Vout (V): 5.0 (0 - 7.5) |
Output Current (A): 25.0 |
K Factor: 1/8 |
Mounting: Surface Mount |
Temperature: -40 to +125°C |
Dimensions mm: 22.83 x 8.52 x 4.90mm |
Dimensions in.: 0.89 x 0.335 x 0.193in |
Package: 2308 |
View Details | ||
| Part Number: | Vin (V): 48 (0 - 60) |
Vout (V): 12.0 (0 - 15) |
Output Current (A): 12.5 |
K Factor: 1/4 |
Mounting: Surface Mount |
Temperature: -40 to +125°C |
Dimensions mm: 22.83 x 8.52 x 4.90mm |
Dimensions in.: 0.89 x 0.335 x 0.193in |
Package: 2308 |
View Details | ||
Power System Designer
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Output
Min output:
Minimum output:
Nom output:
Nominal output:
Max output:
Maximum output:
Features and Benefits
Features and benefits
High density
Wide VIN optimized for 48VOUT
High efficiency
Flexible
Resources
Resources for the design engineer
Attributes of high‑performance power module packaging
Power module packaging, has been a unique differentiator for Vicor since its inception
Innovating power delivery networks
Vicor is innovating with power delivery networks. Improving end-system performance requires innovative power technologies
Modular power delivery networks for UAVs
The key challenge we see facing engineers today is the demand for smaller, lighter-weight designs that deliver higher power
- AN:005 – FPA Printed Circuit Board Layout Guidelines
- AN:009 – SMT J-Lead VI Chip Soldering Recommendations
- AN:017 – RoHS Compliant Through-Hole VI Chip Soldering Recommendations
- AN:031 – Through-Hole ChiP Package Soldering Guidelines
- AN:034 – Creating Higher Voltage Outputs using Series Connected Sine Amplitude Converters
- AN:036 – Recommendations for Maximum Compressive Force of Heat Sinks
- cURus – UL 60950-1, CSA 60950-1
- cTÜVus – EN 60950-1, UL 60950-1, CSA 60950-1
- CE Mark – Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU)
- CB Certificate – IEC 60950-1
- cURus – UL 60950-1, CSA 60950-1
- cTÜVus – EN 60950-1, UL 60950-1, CSA 60950-1
- CE Mark – Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU)
- CB Certificate – IEC 60950-1
- cURus – UL 60950-1, CSA 60950-1
- cTÜVus – EN 60950-1, UL 60950-1, CSA 60950-1
- CE Mark – Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU)
- CB Certificate – IEC 60950-1
- cURus – UL 62368-1, CSA 62368-1
- cTÜVus – EN 60950-1, UL 60950-1, CSA 60950-1
- CE Mark – Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU)
- CB Certificate – IEC 60950-1
For California residents see information regarding California Proposition 65
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Related Products
Related Products
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Wide range direct to point-of-load regulators
High-density, high-efficiency, fixed ratio (non-regulating) isolated DC-DC converter modules
Rugged factorized power solutions