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Rugged output ripple attenuator for VI-200/VI-J00
The
All of the features of the
Features and Benefits
Features and benefits
Reduces output PARD to <10mVP-P
Full attenuation up to 20A load
Compatible with all
Resources
Resources for the design engineer
High‑performance PCB layout and thermal design
This workshop will cover important aspects of PCB design to maximize heat transfer and minimize power delivery impedance and losses
Modular DC-DC system design done right
You will learn topics such as input and output filtering, protections, compatibility with the source and load dynamics
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Ampaire is developing hybrid-electric aircraft that will lead the industry to an all-electric future with net-zero emissions and a greener future
- VI-200, VI-J00 Design Guide and Applications Manual
- 1. Zero-Current Switching
- 2. DC-DC Converter Pinouts
- 3. Module Dos and Donts
- 4. Overcurrent Protection
- 5. Output Voltage Trimming
- 6. Multiple Gate In Connections
- 7. Applications Circuits / Converter Array Design Considerations
- 8. Using Boosters and Parallel Arrays
- 9. EMC Considerations
- 10. Optional Output Filters
- 11. Battery Charger (BatMod)
- 12. AC Input Module (AIM / MI-AIM)
- 13. Harmonic Attenuator Module (HAM)
- 14. Input Attenuator Module (IAM / MI-IAM)
- 15. Ripple Attenuator Module (RAM / MI-RAM)
- 16. Offline Front End
- 17. DC Input Power System (ComPAC / MI-ComPAC Family)
- 18. AC Input Power System (FlatPAC Family)
- 19. AC Input Power System (PFC FlatPAC)
- 20. Thermal and Module Mounting Considerations
- 20. Thermal and Module Mounting Considerations
- 21. Thermal Curves
- 22. Lead Free Pins (RoHS)
- 23. Tin Lead Pins
- 24. Module Packaging Options (SlimMod, FinMod, BusMod and MegaMod Families)
- 25. Product Weights
- 26. Glossary of Technical Terms
For California residents see information regarding California Proposition 65
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