Vicor will present at Mouser Edge Computing event
Edge Computing power demands present many power challenges. High-density power modules enable innovation and greater efficiency
Data Center PRM™ Regulator and VTM™ Current Multiplier
Dedicated factorized power solutions for computing
The Data Center PRM & VTM solutions leverage the value of Factorized Power Architecture™ in demanding, non-isolated server applications providing 48V Direct to POL power conversion for CPU, GPU, ASIC, and memory loads. These solutions provide high density, high efficiency, and low noise conversion for high performance computing.
PRM Regulator Modules
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| Part Number | Datasheet | Vin (V) | Vout (V) | Output Current (A) | Power (W) | VTM Compatibility | Package | Mounting | Temperature | Dimensions mm | Dimensions in. | Add to cart / view details | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Datasheet: | Vin (V): 54.0 (38.0 - 60.0) |
Vout (V): 44.0 (28.0 - 54.0) |
Output Current (A): 2.27 |
Power (W): 100.0 |
VTM Compatibility: Yes |
Package: LGA-SiP |
Mounting: LGA Sip |
Temperature: -40 to +125°C |
Dimensions mm: 10.0 x 10.0 x 2.5mm |
Dimensions in.: 0.394 x 0.394 x 0.101 in |
View Details | ||
VTM Current Mulitplier Modules
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| Part Number | Datasheet | Vin (V) | Vout (V) | Output Current (A) | K Factor | Mounting | Temperature | Dimensions mm | Dimensions in. | Package | Add to cart / view details | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Datasheet: | Vin (V): 43.2 (26.0 - 55.0) |
Vout (V): 1.8 (1.0 - 2.29) |
Output Current (A): 95.0 |
K Factor: 1/24 |
Mounting: SMD |
Temperature: -40 to +125°C |
Dimensions mm: 13.49 x 22.5 x 4.5mm |
Dimensions in.: 0.531 x 0.866 x 0.177in |
Package: 1323 |
View Details | ||
Power System Designer
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Output
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Nom output:
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Max output:
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Features and Benefits
PRM features and benefits
Non-isolated, regulator
ZVS buck-boost topology
~1MHz switching frequency
Power density up to 1,700W/in3 (103W/cm3)
Features and Benefits
VTM features and benefits
Non-isolated, voltage transformer
Up to 135A
High-frequency Sine Amplitude Converter™
Fast transient response
Resources
Resources for the design engineer
Powering the future: Innovations in GenAI power delivery
How staggering are the power requirements of large language models? What can be done to reduce power consumption? Learn what modular power can do
The importance of edge computing
Faster speeds are becoming critically important. Learn what applications are thriving and why power density is so critical to future growth
With AI innovation comes power challenges
Powering genAI is taxing software, hardware and environmental basics. Power modules help achieve higher current density, minimizing the overall impact.
- AN:005 – FPA Printed Circuit Board Layout Guidelines
- AN:017 – RoHS-Compliant Through-Hole VI Chip Soldering Recommendations
- AN:031 – Through-Hole ChiP Package Soldering Guidelines
- AN:032 – Designing High Power Parallel Arrays with PRMs
- AN:033 – Fault Management Circuit
- AN:034 – Creating Higher Voltage Outputs using Series Connected Sine Amplitude Converters
- UG:013 – VI Chip Configurable PRM® Module Evaluation Board Users Guide
- UG:014 - VI Chip VTM® Evaluation Board User Guide
- UG:016 – VI Chip PRM®Remote Sense Evaluation Board User Guide
- For use with PCB part numbers 38693 and 39573
- Datacenter Power Delivery Architectures: Efficency and Annual Operating Costs
- 48 is the New 12 : Server Power in the Rapidly Growing Digital Universe
- FPA Overview: An Introduction to FPA
- Enabling Next Generation High-Density Power Conversion
- High Current, Low Voltage Solution for Microprocessor Applications from 48 V Input
- Efficient Power Conversion Solutions
- Dual-Stage Feedback Technique for Single-Pole Feedback Compensation
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