BCM®
Low Voltage Bus Converter Module

 

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Description

A Sine Amplitude Converter that offers superior performance, the highest efficiency, and highest power density in the smallest package available. Low voltage BCMs provide a fixed ratio conversion to a broad range of output voltages useful for a direct PoL or to a downstream regulator.

Specifications

Input Voltages   36 – 60 V
Output Voltage   From 2.4 – 55.0 V
Output Current   Full/Half Chip: Up to 70 A
6123 ChiP: Up to 150 A
3814 VIA: Up to 150 A
Efficiency   Up to 97.9%
Dimensions  

Full Chip :
32.50 x 22.00 x 6.73 mm

Half Chip :
22.00 x 16.50 x 6.73 mm

6123 ChiP :
61.00 x 25.14 x 7.26 mm

3814 VIA :
3.76 X 1.4 X 0.37 in.

   

 

PDF Icon Family Overview »

 

  

Part Number
Filter Column
Vin (V)
Filter Column
Vout (V)
Filter Column
Current (A)
Filter Column
Package
Filter Column
Control Interface
BCM48Bx480y300A00 » 38 - 55 38.0 - 55.0 6 Full Chip Analog
BCM48Bx320y300A00 » 38 - 55 25.3 - 36.7 9 Full Chip Analog
BCM48BH120T120B00 » 38 - 55 9.5 - 13.75 11.3 Half Chip Analog
BCM48Bx240y300A00 » 38 - 55 19.0 - 27.5 12 Full Chip Analog
BCM48Bx160T240A00 » 38 - 55 12.7 - 18.3 15 Full Chip Analog
BCM48Bx096T240A00 » 38 - 55 7.6 - 11 25 Full Chip Analog
BCM48Bx120y300A00 » 38 - 55 9.5 - 13.80 25 Full Chip Analog
BCM48Bx080T240A00 » 38 - 55 6.34 - 9.16 30 Full Chip Analog
BCM48Bx060T240A00 » 38 - 55 4.75 - 6.87 40 Full Chip Analog
BCM48Bx040T200B00 » 38 - 55 3.2 - 4.6 50 Full Chip Analog
BCM48Bx030T210A00 » 38 - 55 2.4 - 3.4 70 Full Chip Analog
BCM3814x60E15A3yzz » 36 - 60 9 - 15 130 3814 VIA PMBus
BCM6123T60E15A3T00 » 36 - 60 9 - 15 130 6123 ChiP Analog
BCM6123T60E10A5T00 » 36 - 60 6 - 10 150 6123 ChiP Analog
BCM3814x60E10A5yzz » 36 - 60 6 - 10 150 3814 VIA PMBus
1     15 products
Features & Benefits
  • High frequency ZVS/ZCS isolated Sine Amplitude Converter™
  • High density
  • Low weight
  • Low AC impedance: bulk capacitance elimination

 

Diagrams
     
  View in Whiteboard Button  
     
Documentation

 

Application Notes

PDFAN:001 – Configuring the Vicor BCM with Low Power niPOLs »

PDFAN:006 – A Filter Solution for the BCM »

PDFAN:009 – SMT J-Lead VI Chip Soldering Recommendations »
spaceFor surface mount full and half VI Chip packages

PDFAN:016 – Using BCM™ Bus Converters in High Power Arrays »

PDFAN:017 – RoHS Compliant Through-Hole VI Chip Soldering Recommendations »
spaceFor through hole full VI Chip packages

PDFAN:025 – Improving the Light Load Efficiency of a VI Chip Bus Converter Array »

PDFAN:031 – Through-Hole ChiP Package Soldering Guidelines »
spaceFor through-hole ChiP (Converter Housed in a Packages), example packages: 6123,2361, 4623, and 2223

PDFAN:034 – Creating Higher Voltage Outputs using Series Connected Sine Amplitude Converters »

PDFAN:036 – Recommendations for Maximum Compressive Force of Heat Sinks »

PDFAN:037 – Designing a BCM Precharge Circuit »

PDFAN:401 – PCB Mount VIA Soldering Guidelines »

 

 

User Guides / Manuals

PDFUG:001 – VI Chip BCM Evaluation Board User Guide »

PDFUG:015 – Analog Low Voltage/High Voltage 6123 ChiP BCM Bus Converter Evaluation Board User Guide »

 

Safety Approvals

Full-Chip

PDFcURus – UL 60950-1, CSA 60950-1 »

PDFcTÜVus – EN 60950-1, UL 60950-1, CSA 60950-1 »

PDFCE Mark – Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU) »

PDFCB Certificate – IEC 60950-1 »

 

Half-Chip

PDFcURus – UL 60950-1, CSA 60950-1 »

PDFcTÜVus – EN 60950-1, UL 60950-1, CSA 60950-1 »

PDFCE Mark – Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU) »

PDFCB Certificate – IEC 60950-1 »

 

6123 Low Voltage

PDFcURus – UL 60950-1, CSA 60950-1 »

PDFcTÜVus – EN 60950-1, UL 60950-1, CSA 60950-1 »

PDFCE Mark – Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU) »

PDFCB Certificate – IEC 60950-1 »

 

3814 VIA Low Voltage

PDFCE Mark – Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU) »

White Papers

PDFSine Amplitude Converter Topology for IBA»

PDFFPA Overview: An Introduction to FPA »

PDFEnabling Next Generation HIgh-Density Power Conversion »

PDFInnovative Power Device to Support Intermediate Bus Architecture Designs »

PDFDatacenter Power Delivery Architectures: Efficiency and Annual Operating Costs »

PDFEfficient Power Conversion Solutions »

PDFChiP Thermal Management »

 

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Accessories

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