48V and power dense modules solve historic active suspension power problems
Hongfa partners with Vicor to design world’s smallest active suspension power system. Power modules and 48V transform automotive landscape
MI-ComPAC™ DC power supply
The
Power System Designer
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Output
Min output:
Minimum output:
Nom output:
Nominal output:
Max output:
Maximum output:
Features and Benefits
Features and Benefits
One, two or three outputs
MIL‑STD-461C/D/E
MIL‑STD‑704A‑F, 1275A/B/D and DO‑160E compliance for transients
Resources
Resources for the design engineer
World's largest telescope is helping unlock the origins of the Universe
Colossal telescopes employ sophisticated adaptive optics powered by high density modules to enable world-changing discoveries
Advanced power module packaging optimizes available power, reliability and safety in autonomous electric shuttles
Vicor high-efficiency power modules ensure minimal heat dissipation, reducing the need for complex cooling solutions and maximizing power
Providing kilowatts of power for auxiliary systems to a fuel-cell eVTOL aircraft
Vicor high-density power modules effectively manage kilowatts of power and reduce the energy needed for flight
- VI-200, VI-J00 Design Guide and Applications Manual
- VI-200, VI-J00 Design Guide and Applications Manual
- 1. Zero-Current Switching
- 1. Zero-Current Switching
- 2. DC-DC Converter Pinouts
- 3. Module Dos and Donts
- 4. Overcurrent Protection
- 5. Output Voltage Trimming
- 6. Multiple Gate In Connections
- 7. Applications Circuits / Converter Array Design Considerations
- 8. Using Boosters and Parallel Arrays
- 9. EMC Considerations
- 10. Optional Output Filters
- 11. Battery Charger (BatMod)
- 12. AC Input Module (AIM / MI-AIM)
- 12. AC Input Module (AIM / MI-AIM)
- 13. Harmonic Attenuator Module (HAM)
- 14. Input Attenuator Module (IAM / MI-IAM)
- 15. Ripple Attenuator Module (RAM / MI-RAM)
- 16. Offline Front End
- 17. DC Input Power System (ComPAC / MI-ComPAC Family)
- 17. DC Input Power System (ComPAC / MI-ComPAC Family)
- 18. AC Input Power System (FlatPAC Family)
- 19. AC Input Power System (PFC FlatPAC)
- 20. Thermal and Module Mounting Considerations
- 20. Thermal and Module Mounting Considerations
- 21. Thermal Curves
- 22. Lead Free Pins (RoHS)
- 23. Tin Lead Pins
- 24. Module Packaging Options (SlimMod, FinMod, BusMod and MegaMod Families)
- 25. Product Weights
- 26. Glossary of Technical Terms
- Outline Drawing for ComPAC, "L" Configuration (Single)
PDF DXF - Outline Drawing for ComPAC, "M" Configuration (Dual)
PDF DXF - Outline Drawing for ComPAC, "N" Configuration (Triple)
PDF - Outliine Drawing for ComPAC, "N" Configuration (Triple)
DXF - Outline Drawing for ComPAC, "P" Configuration (Dual)
PDF DXF - Outline Drawing for ComPAC, "Q" Configuration (Triple)
PDF DXF - Outline Drawing for ComPAC, "R" Configuration (Triple)
PDF DXF - Outline Drawing for ComPAC, "L" Configuration (Single) -CC*
PDF - Outline Drawing for ComPAC, "L" Configuration (Single) -CC*
DXF - Outline Drawing for ComPAC, "P" Configuration (Dual) -CC*
PDF DXF - Outline Drawing for ComPAC, "M" Configuration (Dual) -CC*
PDF DXF - Outline Drawing for ComPAC, "Q" Configuration (Triple) -CC*
PDF - Outline Drawing for ComPAC, "Q" Configuration (Triple) -CC* »
DXF - Outline Drawing for ComPAC, "R" Configuration (Triple) -CC*
PDF DXF - Outline Drawing for ComPAC, "N" Configuration (Triple) -CC*
PDF DXF
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