Redefining power delivery networks with fixed‑ratio converters
This white paper discusses the fixed ratio, DC DC converter and why designers should consider it an essential part of the power delivery architecture
MI-ComPAC™ DC power supply
The
Power System Designer
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Output
Min output:
Minimum output:
Nom output:
Nominal output:
Max output:
Maximum output:
Features and Benefits
Features and Benefits
One, two or three outputs
MIL‑STD-461C/D/E
MIL‑STD‑704A‑F, 1275A/B/D and DO‑160E compliance for transients
Resources
Resources for the design engineer
Building a smarter ultra-wide DC-DC converter solution with multiple parts
One-size-fits-all typically simplifies situations. However, this approach does not deliver the best results when selecting an ultra-wide DC-DC power supply
Attributes of high‑performance power module packaging
Power module packaging, has been a unique differentiator for Vicor since its inception
Innovating power delivery networks
Every electronic piece of equipment or system has a power delivery network (PDN)
- VI-200, VI-J00 Design Guide and Applications Manual
- VI-200, VI-J00 Design Guide and Applications Manual
- 1. Zero-Current Switching
- 1. Zero-Current Switching
- 2. DC-DC Converter Pinouts
- 3. Module Dos and Donts
- 4. Overcurrent Protection
- 5. Output Voltage Trimming
- 6. Multiple Gate In Connections
- 7. Applications Circuits / Converter Array Design Considerations
- 8. Using Boosters and Parallel Arrays
- 9. EMC Considerations
- 10. Optional Output Filters
- 11. Battery Charger (BatMod)
- 12. AC Input Module (AIM / MI-AIM)
- 12. AC Input Module (AIM / MI-AIM)
- 13. Harmonic Attenuator Module (HAM)
- 14. Input Attenuator Module (IAM / MI-IAM)
- 15. Ripple Attenuator Module (RAM / MI-RAM)
- 16. Offline Front End
- 17. DC Input Power System (ComPAC / MI-ComPAC Family)
- 17. DC Input Power System (ComPAC / MI-ComPAC Family)
- 18. AC Input Power System (FlatPAC Family)
- 19. AC Input Power System (PFC FlatPAC)
- 20. Thermal and Module Mounting Considerations
- 20. Thermal and Module Mounting Considerations
- 21. Thermal Curves
- 22. Lead Free Pins (RoHS)
- 23. Tin Lead Pins
- 24. Module Packaging Options (SlimMod, FinMod, BusMod and MegaMod Families)
- 25. Product Weights
- 26. Glossary of Technical Terms
- Outline Drawing for ComPAC, "L" Configuration (Single)
PDF DXF - Outline Drawing for ComPAC, "M" Configuration (Dual)
PDF DXF - Outline Drawing for ComPAC, "N" Configuration (Triple)
PDF - Outliine Drawing for ComPAC, "N" Configuration (Triple)
DXF - Outline Drawing for ComPAC, "P" Configuration (Dual)
PDF DXF - Outline Drawing for ComPAC, "Q" Configuration (Triple)
PDF DXF - Outline Drawing for ComPAC, "R" Configuration (Triple)
PDF DXF - Outline Drawing for ComPAC, "L" Configuration (Single) -CC*
PDF - Outline Drawing for ComPAC, "L" Configuration (Single) -CC*
DXF - Outline Drawing for ComPAC, "P" Configuration (Dual) -CC*
PDF DXF - Outline Drawing for ComPAC, "M" Configuration (Dual) -CC*
PDF DXF - Outline Drawing for ComPAC, "Q" Configuration (Triple) -CC*
PDF - Outline Drawing for ComPAC, "Q" Configuration (Triple) -CC* »
DXF - Outline Drawing for ComPAC, "R" Configuration (Triple) -CC*
PDF DXF - Outline Drawing for ComPAC, "N" Configuration (Triple) -CC*
PDF DXF
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A highly flexible system of DC input; power building blocks that can be configured for up to 4 outputs